E-Fab Fabricate printed Flex Circuit Board Components printed flexible boards

fabricated microwave circuits for specialized technology applications

 

We manufacture the following parts:

Heat sinks, Interconnects, Thermal frames, layers, and planes, window busses, RF Shields for circuit boards EMI shielding and fence assemblies, PCB stiffeners, carriers, step lids, hybrid step lids, RF EMI shields for specialty flex circuits. Leadframe preproduction, prototype, and manufacturing for high temperature variations and other applications.

Configurations of heatsinks, stiffeners, shields, leadframes, & other various components:


flat
flanged
bent
bossed, risered
photo chemically machined or routed silver soldered assemblies

Materials:


cu: alloy 101 & 110
aluminum: 1100, 6061, 5052
brass, beryllium copper, molybdenum,
stainless steel, spring steel,

magnetic alloys, and other alloys.

Plating and Finishing:


nickel: mil-c-26074b & qq-n-290a
hard anodize: mil-a-8625c
conversion coat: mil-c-5541b
epoxy powder coating
epoxy solder mask coating

Parts inspection:


Per: mil-l-45208a
Note: All of the listed items can be manufactured & be provided in any of the materials, PCB configurations, plating, plus any of the finishings along with inspection.

 

 

 

 

 

Industries served include: PCB, aerospace, communications, computer, electronic, EMI technologies, hybrid, rigid printed circuit boards & rigid flexible, Interconnect, laser, dental medical instrumentation, military, ordinance, optical, power semiconductor, semiconductors, RFID microwave antenna, stacked memory interconnect modules, tactical, weapons systems, & other high tech technology oem's.

 

Contact E-FAB today. We offer prompt delivery, superior quality, prototypes, development projects are welcome. E-FAB, Inc. 1075 Richard Ave., Santa Clara, California. 800.600.3322. We can help engineer & design your special parts. Email, fax, or send us your prints, cad files, or hand drawings. We will be glad to work up a quote for you.

 

Technical Documentation

  1. Fenical, G. (2004) "Shielding for Automotive EMC Design", Compliance Engineering

  2. Clupper, T. (May 2003) "Improve PCB Shielding For Portable Devices", Microwaves & RF

  3. Photochemical Milling Definition


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